Watch a real time inspection of a circuit board assembly.
Genie's AOI system provides ultra fast, consistent, reliable inspection of both surface mount and through hole components. The YESTech YTV-B3HM's eliminates inconsistencies that are associated with visual inspection. When used in conjunction with X-ray and functional testing, it combines to form a highly effective system of ensuring that every one of Genie's products is defect free.
Features of the YESTech YTV-B3HM include:
2 camera system - 25 micron & 12.5 micron
20 in. by 18 in. panel size capability
Fusion lighting multi-angle LED lighting system
Accommodates Gerber, CAD, CAM and ASCII text
Inspects 4 square inches per second
12.5 micron camera allows inspection down to 01005 size component
Genie utilizes a Glenbrook Technologies RTX-113 X-ray system to provide detailed inspection of BGA, QFN, MLF, and other packages where the solder connections are made underneath the component.
The RTX-113 system features the following:
Real time X-ray analysis
50x magnification
Determine defects as small as 0.001 inches
Inspect BGA, QFN, MLF, and other packages
1 inch diameter field of view
Capture and analyze digital images
Genie at a glance
Quality you can count on
Turn-key assembly
Made in USA
Experienced staff
Established in 1988
IPC-A-610 class 2 and 3
RoHS assembly
Consistent Communication
Reliable delivery
Excellent component resources
Customer confidence
Location
State of the art facility is near
all major roadways.
