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From simple surface mount designs to complex high density circuits, Genie's automated surface mount assembly line provides high speed, repeatable assembly to meet your performance requirements. |
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Your simple or multi layer boards are perfect for Genie's automated surface mount assembly line. Genie assembles high density designs that include BGA's, 0402 size components, high density quad flat packs, 20 mil pitch components, and RoHS compliant components. Our surface mount equipment will easily accommodate board designs of 12 inches by 10 inches. |
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It takes more than good equipment to provide reliable and repeatable surface mount assembly. At Genie, we combine our expert production staff and documentation packages with our Fuji equipment to provide the highest level of value available in the electronics manufacturing services industry today. A MPM Accuflex screen printer assures of consistent solder paste application. A Fuji GL-V provides pinpoint accuracy of glue placement for double sided reflow applications. Our Fuji IP-3 and CP-3 place components of a variety of densities and packaging styles. A Conceptronic HVA70 four-zone convection reflow oven provides accurate and precise temperature ramps and stabilization zones for consistent reflow and glue cure. |
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Genie utilizes a full time maintenance staff and intensive maintenance schedule to ensure our equipment is running at its peak condition. Genie is currently running both RoHS compliant and non-RoHS compliant surface mount designs. Our in-process and 100% final inspection plans provide us with the necessary process reviews to ensure consistent quality levels. |
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Genie at a glance |
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30,000 sq. ft. facility |
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Located in York, PA |
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32 employees |
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Established in 1988 |
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Workmanship to IPC-A-610
and J-STD-001 Class 2 and 3 |
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Markets served |
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Industrial |
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Medical |
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Military |
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High Frequency |
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Automotive |
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Communications |
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Location |
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State of the art facility is near
all major roadways. |
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