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From simple surface mount designs to complex high density circuits, Genie's automated surface mount assembly line provides high speed, repeatable assembly to meet your performance requirements. |
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Your simple or multi layer boards are perfect for Genie's automated surface mount assembly line. Genie assembles high density designs that include BGA's, 0402 size components, high density quad flat packs, 20 mil pitch components, and RoHS compliant components. Our surface mount equipment will easily accommodate board designs of 12 inches by 10 inches. |
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It takes more than good equipment to provide reliable and repeatable surface mount assembly. At Genie, we combine our expert production staff and documentation packages with our Fuji equipment to provide the highest level of value available in the electronics manufacturing services industry today. A MPM Accuflex screen printer assures of consistent solder paste application. Our Fuji IP-3 and two CP-IV3 chip shooters place components of a variety of densities and packaging styles. A Conceptronic HVA70 four-zone convection reflow oven provides accurate and precise temperature ramps and stabilization zones for consistent reflow and glue cure. |
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Genie utilizes a full time maintenance staff and intensive maintenance schedule to ensure our equipment is running at its peak condition. Genie is currently running both RoHS compliant and non-RoHS compliant surface mount designs. Our in-process and 100% final inspection plans provide us with the necessary process reviews to ensure consistent quality levels. |
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Genie at a glance |
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Quality you can count on |
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Turn-key assembly |
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Made in USA |
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Experienced staff |
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Established in 1988 |
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IPC-A-610 class 2 and 3 |
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RoHS assembly |
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Consistent Communication |
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Reliable delivery |
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Excellent component resources |
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Customer confidence |
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Location |
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State of the art facility is near
all major roadways. |
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